Arizona Wins: State selected for CHIPS-funded national facility for semiconductor advanced packaging
MAP Strategies Group and ASU News
Whew! We’re still catching our breath after the double-overtime performance of the Arizona State University football team’s performance in the Peach Bowl, and now this.
In a victory for the entire state and a critical step forward for America’s efforts to reclaim its place as the global leader in digital technology, the U.S. Commerce Department and Natcast — the operator of the National Semiconductor Technology Center (NSTC) — announced the selection of Arizona and Arizona State University as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility.
It is the third of three CHIPS for America research and development flagship facilities, and the one with the largest financial investment. The final terms are being negotiated and will be announced soon.
“I am so proud of my colleagues who were able to deliver this outstanding outcome for the state and the university community, securing this once-in-generation opportunity and cementing ASU’s position among the world’s top research and development institutions,” says Mi-Ai Parrish, MAP Strategies Group CEO and Managing Director of ASU’s Media Enterprise.
Located at ASU Research Park in Tempe, adjacent to the university’s MacroTechnology Works building, the new facility will combine semiconductor research and prototyping for front-end manufacturing and packaging capabilities, meeting a unique need for advanced packaging R&D within the U.S. semiconductor ecosystem.
The facility — part of the CHIPS for America initiative, which aims to strengthen the U.S. semiconductor supply chain and accelerate cutting-edge research and development — is expected to be operational as early as the fourth quarter of 2028, representing hundreds of new jobs and billions of dollars of investment.